JPH078865Y2 - ロータリー圧縮機 - Google Patents
ロータリー圧縮機Info
- Publication number
- JPH078865Y2 JPH078865Y2 JP15382688U JP15382688U JPH078865Y2 JP H078865 Y2 JPH078865 Y2 JP H078865Y2 JP 15382688 U JP15382688 U JP 15382688U JP 15382688 U JP15382688 U JP 15382688U JP H078865 Y2 JPH078865 Y2 JP H078865Y2
- Authority
- JP
- Japan
- Prior art keywords
- eccentric
- outer peripheral
- eccentric part
- rotary compressor
- maximum
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15382688U JPH078865Y2 (ja) | 1988-11-25 | 1988-11-25 | ロータリー圧縮機 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15382688U JPH078865Y2 (ja) | 1988-11-25 | 1988-11-25 | ロータリー圧縮機 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0274587U JPH0274587U (en]) | 1990-06-07 |
JPH078865Y2 true JPH078865Y2 (ja) | 1995-03-06 |
Family
ID=31430009
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15382688U Expired - Lifetime JPH078865Y2 (ja) | 1988-11-25 | 1988-11-25 | ロータリー圧縮機 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH078865Y2 (en]) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7538473B2 (en) | 2004-02-03 | 2009-05-26 | S.C. Johnson & Son, Inc. | Drive circuits and methods for ultrasonic piezoelectric actuators |
KR20130081108A (ko) * | 2012-01-06 | 2013-07-16 | 엘지전자 주식회사 | 로터리 압축기 |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6620723B1 (en) | 2000-06-27 | 2003-09-16 | Applied Materials, Inc. | Formation of boride barrier layers using chemisorption techniques |
US7405158B2 (en) | 2000-06-28 | 2008-07-29 | Applied Materials, Inc. | Methods for depositing tungsten layers employing atomic layer deposition techniques |
US6551929B1 (en) | 2000-06-28 | 2003-04-22 | Applied Materials, Inc. | Bifurcated deposition process for depositing refractory metal layers employing atomic layer deposition and chemical vapor deposition techniques |
US6951804B2 (en) | 2001-02-02 | 2005-10-04 | Applied Materials, Inc. | Formation of a tantalum-nitride layer |
US6878206B2 (en) | 2001-07-16 | 2005-04-12 | Applied Materials, Inc. | Lid assembly for a processing system to facilitate sequential deposition techniques |
US7085616B2 (en) | 2001-07-27 | 2006-08-01 | Applied Materials, Inc. | Atomic layer deposition apparatus |
US6936906B2 (en) | 2001-09-26 | 2005-08-30 | Applied Materials, Inc. | Integration of barrier layer and seed layer |
US7049226B2 (en) | 2001-09-26 | 2006-05-23 | Applied Materials, Inc. | Integration of ALD tantalum nitride for copper metallization |
US6911391B2 (en) | 2002-01-26 | 2005-06-28 | Applied Materials, Inc. | Integration of titanium and titanium nitride layers |
US6833161B2 (en) | 2002-02-26 | 2004-12-21 | Applied Materials, Inc. | Cyclical deposition of tungsten nitride for metal oxide gate electrode |
US7262133B2 (en) | 2003-01-07 | 2007-08-28 | Applied Materials, Inc. | Enhancement of copper line reliability using thin ALD tan film to cap the copper line |
-
1988
- 1988-11-25 JP JP15382688U patent/JPH078865Y2/ja not_active Expired - Lifetime
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7538473B2 (en) | 2004-02-03 | 2009-05-26 | S.C. Johnson & Son, Inc. | Drive circuits and methods for ultrasonic piezoelectric actuators |
KR20130081108A (ko) * | 2012-01-06 | 2013-07-16 | 엘지전자 주식회사 | 로터리 압축기 |
KR101878670B1 (ko) * | 2012-01-06 | 2018-07-16 | 엘지전자 주식회사 | 로터리 압축기 |
Also Published As
Publication number | Publication date |
---|---|
JPH0274587U (en]) | 1990-06-07 |
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